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Newest additions are related to the company's material technology and implant design.
July 22, 2019
By: OssDsign AB
The European Patent Office (EPO) has said it intends to grant OssDsign AB two new European patents related to the company’s material technology and implant design. This further strengthens OssDsign’s extensive patent protection in the field of ceramic material formulations and their applications for medical use. The first patent covers the implant, its support structure, as well as the method of making a custom implant through additive manufacturing. The additive manufacturing process provides a number of advantages, including rapid fabrication of customized implants for each patient, including various implant properties such as localized stiffness and/or localized flexibility, as well as the ability to fabricate implants with complex and/or irregular geometries (including complex curved surfaces). The second patent covers an efficient method of making a shaped porous ceramic cement article. The patents cover the European market and are valid to 2034 and 2035 respectively. Earlier this year, OssDsign AB raised 64 million Swedish Kroner through a combination of Swedish private investors and the French investment management company Alto Invest. OssDsign is using the funds to work toward a stock exchange listing this year. OssDsign is a Swedish medical technology company that develops and manufactures regenerative implants for improved healing of bone defects. Providing neuro and plastic surgeons with innovative implants, OssDsign improves the outcome for patients with severe cranial and facial defects worldwide. By combining clinical knowledge with proprietary technology, OssDsign manufactures and sells a growing range of patient-specific solutions for treating cranial defects and facial reconstruction. OssDsign’s technology is the result of collaboration between clinical researchers at Karolinska University Hospital in Stockholm and material scientists at the Ångström Laboratory at Uppsala University.
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